A displacement‐based analytical stress solution for various adhesive joint configurations. Issue 1 (25th January 2021)

• Record Type: Journal Article
• Authors: Methfessel, Thomas S.; Becker, Wilfried
• Other Names: Kuhl D. guestEditor.; Meister A. guestEditor.; Ricoeur A. guestEditor.; Wünsch O. guestEditor.
• Is Part Of: Proceedings in applied mathematics and mechanics. Volume 20:Issue 1(2021)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2021-01-25
• Subjects: Applied mathematics -- Periodicals; Engineering mathematics -- Periodicals; Mathematical physics -- Periodicals; 519
• DOI: 10.1002/pamm.202000020
• Languages: English
• ISSNs: 1617-7061

Abstract

Abstract: The present work provides a simple and precise thermo‐mechanical model for the prediction of stress distributions in adhesive joints. A displacement‐based derivation is applied, using a general sandwich‐type model for the overlap region. For the adhesive layer a linear displacement approach is proposed, which captures the variation of the shear stresses in the through‐thickness direction. The model covers various joint configurations with linear‐elastic material behavior under different load cases.