Active Damping of Thin Film Shape Memory Alloy Devices. Issue 1 (25th January 2021)

• Record Type: Journal Article
• Authors: Ahmadi, S.; Jacob, K.; Wendler, F.; Padhy, A.; Kohl, M.
• Other Names: Kuhl D. guestEditor.; Meister A. guestEditor.; Ricoeur A. guestEditor.; Wünsch O. guestEditor.
• Is Part Of: Proceedings in applied mathematics and mechanics. Volume 20:Issue 1(2021)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2021-01-25
• Subjects: Applied mathematics -- Periodicals; Engineering mathematics -- Periodicals; Mathematical physics -- Periodicals; 519
• DOI: 10.1002/pamm.202000310
• Languages: English
• ISSNs: 1617-7061

Abstract

Abstract: The thermomechanical coupling in shape memory alloys (SMAs) provides an effective mechanism of vibration damping by a cyclic structural phase transition. Here, we present simulations for an active SMA damper device based on a polycrystalline film materials, in which active damping via the one‐way shape memory effect is exploited. We apply an extension of a previously reported superelastic model, that combines transition state kinetics with a phase field approach for the case of shock loading. By this approach, we are able to describe the time‐resolved active damping performance of the device in agreement with experimental results.