A Concurrent Enhancement of Both In‐Plane and Through‐Plane Thermal Conductivity of Injection Molded Polycarbonate/Boron Nitride/Alumina Composites by Constructing a Dense Filler Packing Structure. Issue 9 (15th June 2021)

• Record Type: Journal Article
• Authors: Bai, Yang; Shi, You; Zhou, Shengtai; Zou, Huawei; Liang, Mei
• Is Part Of: Macromolecular materials and engineering. Volume 306:Issue 9(2021)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2021-06-15
• Subjects: injection molding -- polycarbonates -- rheological properties -- thermal conductivity; Plastics -- Periodicals; Polymers -- Periodicals; Polymerization -- Periodicals; 547.705
• DOI: 10.1002/mame.202100267
• Languages: English
• ISSNs: 1438-7492

Abstract

Abstract: In this work, a facile strategy is proposed to concurrently enhance both in‐plane and through‐plane thermal conductivity of injection molded polycarbonate (PC)‐based composites by constructing a dense filler packing structure with planar boron nitride (BN) and spherical alumina (Al2 O3 ) particles. The state of orientation of BN platelets is altered with the presence of Al2 O3, which is favorable for improving both in‐plane and through‐plane thermal conductivity of subsequent moldings. Rheological analysis showed that the formation of intact thermal conductive pathways is crucial to the overall enhancement of thermal conductivity. Both in‐plane and through‐plane thermal conductivity of PC/BN(20 wt%)/Al2 O3 (40 wt%) composites reached as high as 1.52 and 1.09 W mK −1, which are 485% and 474% higher than that of pure PC counterparts, respectively. Furthermore, the prepared samples demonstrated excellent electrical insulation and dielectric properties which show potential application in electronic and automotive industries. Abstract : A facile strategy is proposed to concurrently enhance both the in‐plane and through‐plane thermal conductivity of injection molded polycarbonate/boron nitride (PC/BN) composites via introducing alumina (Al2 O3 ) particles. The in‐plane and through‐plane thermal conductivity of the PC/BN (20 wt%)/Al2 O3 (40 wt%) composite reach 1.52 and 1.09 W mK −1, respectively, which are 485% and 474% higher than that of pure PC counterparts.