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HARVARD Citation
Ren, W. et al. (2021). Experimental investigation of cold adhesion failure physical mechanism of gold plated contact within the Micro-Electromechanical-Relay. Engineering failure analysis. p. . [Online].
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Ren, W. et al. (2021). Experimental investigation of cold adhesion failure physical mechanism of gold plated contact within the Micro-Electromechanical-Relay. Engineering failure analysis. p. . [Online].