Highly efficient soldering of Sn-Ag-Cu solder joints using blue laser. (October 2022)
- Record Type:
- Journal Article
- Title:
- Highly efficient soldering of Sn-Ag-Cu solder joints using blue laser. (October 2022)
- Main Title:
- Highly efficient soldering of Sn-Ag-Cu solder joints using blue laser
- Authors:
- Tatsumi, Hiroaki
Kaneshita, Seiji
Kida, Yuki
Sato, Yuji
Tsukamoto, Masahiro
Nishikawa, Hiroshi - Abstract:
- Abstract: Laser soldering has been widely used to connect electronic components to printed circuit boards (PCBs), owing to its significant advantages, including localized heating, noncontact heating, rapid temperature rise and fall, good controllability, and high adaptability. However, poor absorptivity of the metals involved is one of the main drawbacks of traditional infrared (IR) laser soldering. In this study, we constructed a novel blue diode laser soldering system to validate its higher heat efficiency compared to that of an IR diode laser. A comparative study of blue and IR lasers for Sn-Ag-Cu solder/PCB joints performed by varying the laser process parameters revealed that the blue laser enabled joint formation at a lower laser output power and irradiation time. Furthermore, miniature impact tests of the joints fabricated using the blue laser at 8 W and those fabricated using the IR laser at 14 W revealed comparable joint impact strengths. The comparability of the 8-W blue and 14-W IR laser processes was confirmed by microstructure observations. These experimental results proved that blue laser soldering exhibited 43 % higher efficiency than IR laser soldering. This increased efficiency was further successfully validated by measuring the light absorption rate on the solder and performing simple thermal calculations based on this measurement. These results clearly show that blue laser soldering can be used as a highly energy-efficient electronic packaging technology.Abstract: Laser soldering has been widely used to connect electronic components to printed circuit boards (PCBs), owing to its significant advantages, including localized heating, noncontact heating, rapid temperature rise and fall, good controllability, and high adaptability. However, poor absorptivity of the metals involved is one of the main drawbacks of traditional infrared (IR) laser soldering. In this study, we constructed a novel blue diode laser soldering system to validate its higher heat efficiency compared to that of an IR diode laser. A comparative study of blue and IR lasers for Sn-Ag-Cu solder/PCB joints performed by varying the laser process parameters revealed that the blue laser enabled joint formation at a lower laser output power and irradiation time. Furthermore, miniature impact tests of the joints fabricated using the blue laser at 8 W and those fabricated using the IR laser at 14 W revealed comparable joint impact strengths. The comparability of the 8-W blue and 14-W IR laser processes was confirmed by microstructure observations. These experimental results proved that blue laser soldering exhibited 43 % higher efficiency than IR laser soldering. This increased efficiency was further successfully validated by measuring the light absorption rate on the solder and performing simple thermal calculations based on this measurement. These results clearly show that blue laser soldering can be used as a highly energy-efficient electronic packaging technology. Graphical abstract: Unlabelled Image Highlights: Common soldering materials have poor absorptivity in the infrared (IR) laser range. We constructed a blue diode laser soldering system to validate its efficiency. Blue laser soldering exhibited 43 % higher efficiency than its IR counterpart. The 8-W blue and 14-W IR lasers gave comparable joint strength and microstructure. … (more)
- Is Part Of:
- Journal of manufacturing processes. Volume 82(2022)
- Journal:
- Journal of manufacturing processes
- Issue:
- Volume 82(2022)
- Issue Display:
- Volume 82, Issue 2022 (2022)
- Year:
- 2022
- Volume:
- 82
- Issue:
- 2022
- Issue Sort Value:
- 2022-0082-2022-0000
- Page Start:
- 700
- Page End:
- 707
- Publication Date:
- 2022-10
- Subjects:
- Laser soldering -- Blue laser -- Sn-Ag-Cu solder -- Impact strength -- Microstructure -- Heat efficiency
Production management -- Data processing -- Periodicals
Manufacturing processes -- Periodicals
Procestechnologie
Productietechniek
Production -- Gestion -- Informatique -- Périodiques
Fabrication -- Périodiques
Manufacturing processes
Production management -- Data processing
Periodicals
670.5 - Journal URLs:
- http://www.sciencedirect.com/science/journal/15266125 ↗
http://www.elsevier.com/journals ↗ - DOI:
- 10.1016/j.jmapro.2022.08.025 ↗
- Languages:
- English
- ISSNs:
- 1526-6125
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - 5011.640000
British Library DSC - BLDSS-3PM
British Library HMNTS - ELD Digital store - Ingest File:
- 23385.xml