Cite
HARVARD Citation
Yang, Y. et al. (2022). Embedded microfluidic cooling with compact double H type manifold microchannels for large-area high-power chips. International journal of heat and mass transfer. p. . [Online].
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Yang, Y. et al. (2022). Embedded microfluidic cooling with compact double H type manifold microchannels for large-area high-power chips. International journal of heat and mass transfer. p. . [Online].