Experimental evaluation of a thermal contact liquid cooling system for server electronics. (25th January 2018)
- Record Type:
- Journal Article
- Title:
- Experimental evaluation of a thermal contact liquid cooling system for server electronics. (25th January 2018)
- Main Title:
- Experimental evaluation of a thermal contact liquid cooling system for server electronics
- Authors:
- Kheirabadi, Ali C.
Groulx, Dominic - Abstract:
- Highlights: A thermal contact water cooling system is proposed and experimentally evaluated. The system eliminates leakage risks by replacing fluidic connectors with a heat exchanger. An experimental setup simulating heat dissipation from a single processor is constructed. The system requires inlet water at 53.2 °C to maintain a 300 W heat source below 85 °C. The system consumes 43% more power than conventional water cooling in warm regions. Abstract: This paper presents the outcomes of a research project aimed at designing and experimentally evaluating a thermal contact liquid cooling system for military applications. The proposed system replaces fluidic connectors found in conventional water cooling systems with a thermal contact heat exchanger. This approach enhances reliability by eliminating leakage risks; however, it also undermines thermal performance by adding thermally resistive heat transfer interfaces. Experiments were conducted to quantify the downgraded thermal performance and to establish whether it is a viable trade-off for enhanced reliability. An experimental setup was constructed in order to simulate heat generation by a single processor. Results showed that the proposed system requires inlet water as warm as 53.2 °C at a maximum heat load of 300 W. For comparison, it was also shown that the proposed thermal contact water cooling system would require 43% more energy than a conventional water cooling system if operating at ambient temperatures sufficientlyHighlights: A thermal contact water cooling system is proposed and experimentally evaluated. The system eliminates leakage risks by replacing fluidic connectors with a heat exchanger. An experimental setup simulating heat dissipation from a single processor is constructed. The system requires inlet water at 53.2 °C to maintain a 300 W heat source below 85 °C. The system consumes 43% more power than conventional water cooling in warm regions. Abstract: This paper presents the outcomes of a research project aimed at designing and experimentally evaluating a thermal contact liquid cooling system for military applications. The proposed system replaces fluidic connectors found in conventional water cooling systems with a thermal contact heat exchanger. This approach enhances reliability by eliminating leakage risks; however, it also undermines thermal performance by adding thermally resistive heat transfer interfaces. Experiments were conducted to quantify the downgraded thermal performance and to establish whether it is a viable trade-off for enhanced reliability. An experimental setup was constructed in order to simulate heat generation by a single processor. Results showed that the proposed system requires inlet water as warm as 53.2 °C at a maximum heat load of 300 W. For comparison, it was also shown that the proposed thermal contact water cooling system would require 43% more energy than a conventional water cooling system if operating at ambient temperatures sufficiently higher than 50 °C. … (more)
- Is Part Of:
- Applied thermal engineering. Volume 129(2018)
- Journal:
- Applied thermal engineering
- Issue:
- Volume 129(2018)
- Issue Display:
- Volume 129, Issue 2018 (2018)
- Year:
- 2018
- Volume:
- 129
- Issue:
- 2018
- Issue Sort Value:
- 2018-0129-2018-0000
- Page Start:
- 1010
- Page End:
- 1025
- Publication Date:
- 2018-01-25
- Subjects:
- High power electronics -- Thermal management -- Electronics cooling -- Liquid cooling -- Thermal contact heat exchanger
Heat engineering -- Periodicals
Heating -- Equipment and supplies -- Periodicals
Periodicals
621.40205 - Journal URLs:
- http://www.sciencedirect.com/science/journal/13594311 ↗
http://www.elsevier.com/homepage/elecserv.htt ↗
http://www.elsevier.com/journals ↗ - DOI:
- 10.1016/j.applthermaleng.2017.10.098 ↗
- Languages:
- English
- ISSNs:
- 1359-4311
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - 1580.101000
British Library DSC - BLDSS-3PM
British Library HMNTS - ELD Digital store - Ingest File:
- 23169.xml