Cite
HARVARD Citation
Pilet, T. et al. (2022). Modeling of transient conduction in building envelope assemblies: A review. Science and technology for the built environment. pp. 706-716. [Online].
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Pilet, T. et al. (2022). Modeling of transient conduction in building envelope assemblies: A review. Science and technology for the built environment. pp. 706-716. [Online].