The Design and Thermal Reliability Analysis of a High-Efficiency K-Band MMIC Medium-Power Amplifier with Multiharmonic Matching. (19th May 2016)

• Record Type: Journal Article
• Authors: Shang, Y.; Xu, H.; Mo, J.; Wang, Z.; Xu, X.; Tu, Z.; Zhang, X.; Zheng, H.; Chen, W.; Yu, F.
• Other Names: Ghibaudo Gerard Academic Editor.
• Is Part Of: Active and passive electronic components. Volume 2016(2016)
• Publication Date: 2016-05-19
• Subjects: Electronics -- Periodicals; Passive components -- Periodicals; Electronic apparatus and appliances -- Periodicals; 621.381505
• DOI: 10.1155/2016/6295405
• Languages: English
• ISSNs: 0882-7516

Abstract

Abstract : A new high-efficiency K-band MMIC medium-power amplifier (PA) is designed with multiharmonic matching using GaAs pHEMT process technology. It has an operation frequency centered at 26 GHz with a bandwidth of 2 GHz. A 20 dBm 1 dB-compression-point output power and 40% efficiency are achieved. A novel thermal reliability analysis method based on ICEPAK is proposed also to evaluate its thermal characteristic. The test result by using a QFI InfraScope ™ infrared imaging system is compared with the simulation result. It agrees well with an accuracy within ±1°C differences, which reflects the advantages of the thermal analysis method with respect to accuracy and convenience for use.