Study on the thermal resistance comparison on Al with SiO2 composites for electronics chips. (2020)

• Record Type: Journal Article
• Authors: Pradhan, Raghuram; Chandrika, V.S.; Thilagavathi, G.; Muruganandam, D.; Hariprasad, K.; Adlin Paul, J.
• Is Part Of: Materials today. Volume 33:Part 7(2020)
• Page Start: 2850
• Page End: 2853
• Publication Date: 2020
• Subjects: Aluminium -- Silicon dioxide -- Silicone grease -- Thermal resistance -- Heat transfer; Materials science -- Congresses -- Periodicals; 620.1
• DOI: 10.1016/j.matpr.2020.02.710
• Languages: English
• ISSNs: 2214-7853

Abstract

Abstract: Aluminium and Silicon dioxide (Al & SiO2 ) combinations with different proportionality of weight basis specimens created with low thermal conductivity material such as G 641 Silicone grease. In this investigation three different combinations produced and tested the theoretical and actual thermal resistance for the heat transfer rate. This combination prepared for the utilization on the electronic microchip cooling purpose because of its need of cooling to maintain its performance and life of that particular electronic chip.