Development of a modulus of subgrade reaction model to improve slab-base interface bond sensitivity. Issue 14 (5th December 2020)

• Record Type: Journal Article
• Authors: Saha, Sajib; Gu, Fan; Luo, Xue; Lytton, Robert L.
• Is Part Of: International journal of pavement engineering. Volume 21:Issue 14(2020)
• Page Start: 1794
• Page End: 1805
• Publication Date: 2020-12-05
• Subjects: Modulus of subgrade reaction -- rigid pavement design -- interface shear bonding -- long-term pavement performance -- artificial neural network; Pavements -- Design and construction -- Periodicals; Highway engineering -- Periodicals; 625.805
• DOI: 10.1080/10298436.2019.1567921
• Languages: English
• ISSNs: 1029-8436

Abstract

ABSTRACT: In the Pavement ME Design, the modulus of subgrade reaction ( k -value) is characterised by the dense liquid or Winkler model, which does not consider the interface bond within the supporting media. In this study, a modified k -value model was developed to take into account the shear interaction between concrete slab and base course. Formulation of the modified k -value model contained four steps: (a) correction of cross anisotropic base modulus; (b) development of a submodel for slab-base equivalent thickness; (c) development of a formula for slab-base interface shear bonding; and (d) determination of k -value using the calculated shear bonding and the deflection patterns of falling weight deflectometer (FWD). A large number of rigid pavement structural and strength properties and the corresponding FWD deflection patterns data were collected from the Long-Term Pavement Performance database and used to calculate the modified k -value. These were compared against the k -values using the existing 'backcalculated best-fit approach'. The results showed that the modified k -values changed significantly due to the consideration of cross anisotropy and slab-base interface bonding. Finally, an artificial neural network (ANN) approach was employed to predict the modified k -values for the given pavement structures, layer moduli and interface bonding ratios.