Palladium Ultrathin Film Growth by Surface-Limited Redox Replacement of Cu and H UPD Monolayers: Approaches, Pros, Cons, and Comparison. (1st January 2018)

• Record Type: Journal Article
• Authors: Dimitrov, Nikolay; Achari, Innocent; Ambrozik, Stephen
• Is Part Of: Electrochemical Society Interface. Volume 27:Number 2(2018)
• Page Start: 65
• Page End: 69
• Publication Date: 2018-01-01
• Subjects: Palladium -- SLRR -- E-ALD -- electrodeposition -- thin films -- catalysis
• DOI: 10.1149/2.F06182if
• Languages: English
• ISSNs: 1064-8208

Abstract

Abstract : This paper presents a comparative overview of most recent developments in electrochemical Pd ultrathin film deposition. The growth of Pd in atomic layer deposition (ALD) mode using a surface limited redox replacement reaction (SLRR) as a building block is administered in two different ways. In the first approach, the SLRR step is carried out in an automated flow cell and in the second, the redox exchange takes place in one cell containing all participating ions and complexes. The critical analysis of both deposition means, suggests that the choice of approach to grow Pd ultrathin films depends on the application purposes and on the desired film properties. For instance, if a thicker Pd film that is still continuous and uniform at a thickness of 50-60 equivalent monolayers (ML) is of interest, a better choice would be the flow-cell setup that guarantees the lack of mass-transport limitations and thus promotes the deposition sustainability. In contrast, if cost-effective Pd catalytic coatings of thickness up to 10 MLs are needed, a better and more straight forward choice would be the one-cell setup that provides remarkable simplicity, low cost, and better time management for an overall greener deposition effort.