(Invited)Substrate and Device Engineering for IoT and Automotive. (10th April 2018)

• Record Type: Journal Article
• Authors: Sellier, Manuel
• Is Part Of: ECS transactions. Volume 85:Number 8(2018)
• Page Start: 3
• Page End: 13
• Publication Date: 2018-04-10
• Subjects: Electrochemistry -- Periodicals; Electrochemistry; Periodicals; Electronic journals; Electronic journal; 541.37
• DOI: 10.1149/08508.0003ecst
• Languages: English
• ISSNs: 1938-5862

Abstract

Abstract : Today, there is a growing proportion of overall semiconductor consumption that is not driven by pure performance nor density. Internet of Things (IoT) and automotive are perfect examples of this, where increased energy efficiency combined with enhanced reliability and communication functions integration have become the most important challenges to overcome, ahead of performance and density. Advanced substrates such as Silicon On Insulator (SOI) are progressively emerging as key platforms to address these challenges. We will discuss in this paper how three engineered substrate platforms, Power-SOI, RF-SOI and FD-SOI are currently reshaping IoT & automotive with new industry standards.