Influence of thickness reduction in base plate on elastic stress state of patch plate joint by combination of welding and bonding. Issue 1 (4th March 2019)

• Record Type: Journal Article
• Authors: Hirohata, Mikihito; Fujimura, Naoki
• Is Part Of: Welding international. Volume 33:Issue 1/3(2019)
• Page Start: 96
• Page End: 108
• Publication Date: 2019-03-04
• Subjects: Welding -- bonding -- patch plate joint -- thickness reduction -- weld root -- stress concentration; Welding -- Periodicals; Welding -- Automation -- Periodicals; 671.52
• DOI: 10.1080/09507116.2020.1866910
• Languages: English
• ISSNs: 0950-7116

Abstract

ABSTRACT: For investigating the influence of thickness reduction in base plate on elastic stress state of patch plate joint by combination of welding and bonding, a series of experiment and analysis were conducted. A static tensile loading experiment was carried out. The thickness reductions of 2.5 mm were applied to both top and bottom surfaces of a base plate with a thickness of 12 mm. The thickness-reduced parts of the base plate were covered by the patch plates with a thickness of 6 mm. The joining methods of patch plates were only fillet welding, only bonding and the combination of welding and bonding. The load-carrying effect at the centre of the joint was improved by the combination of welding and bonding compared to the case with only welding. However, the stress reduction effect around the welded part could not be clearly confirmed from the experimental result. The 2D elastic analysis was performed for simulating the experiment and examining the stress reduction effect around the welded part in detail. Furthermore, the influence of the degree of thickness reduction in base plate on the stress state around the welded part was investigated. The results indicated that the stress reduction effect by the combination of welding and bonding was larger around the weld root rather than the weld toe.