Pressure Dependence on the Thermal Conductivity of H‐ and J‐type Nanocomposites (Adv. Mater. Interfaces 21/2022). Issue 21 (22nd July 2022)

• Record Type: Journal Article
• Authors: Hong, Younggi; Goh, Munju
• Is Part Of: Advanced materials interfaces. Volume 9:Issue 21(2022)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2022-07-22
• Subjects: epoxy mold compound -- H‐ and J‐ type aggregation molecule -- heat dissipation -- nanocomposites -- thermal conductivity; Materials science -- Periodicals; 620.11
• DOI: 10.1002/admi.202270120
• Languages: English
• ISSNs: 2196-7350

Abstract

Abstract : Pressure Dependence on Thermal Conductivity of H‐ and J‐Type Composites The H‐ and J‐type composites show a different pressure dependence of the thermal conductivity as reported in article number 2200027 by Younggi Hong and Munju Goh. As the pressure increases, the H‐ and J‐type aggregation composite demonstrates a different thermal conductivity pathway in the other direction and other conductive fillers are guided by H‐ and J‐ type aggregation. It is expected to be advantageous for heat dissipation applications to electric devices.