0D surface modification and 3D silicon carbide network construction for improving the thermal conductivity of epoxy resins. Issue 18 (15th September 2022)

• Record Type: Journal Article
• Authors: Li, Zhilei; Zhao, Tao; Yan, Gaojie; Yuan, Yanan; Yu, Xiaoyan; Naito, Kimiyoshi; Zhang, Qingxin
• Is Part Of: Ceramics international. Volume 48:Issue 18(2022)
• Page Start: 26651
• Page End: 26659
• Publication Date: 2022-09-15
• Subjects: Silicon carbide -- Thermal conductivity -- Polyvinyl butyral (PVB) -- Epoxy -- Molecular simulation; Ceramics -- Periodicals; Céramique industrielle -- Périodiques; Ceramics; Periodicals; Electronic journals; 666
• DOI: 10.1016/j.ceramint.2022.05.359
• Languages: English
• ISSNs: 0272-8842

Abstract

Abstract: With rapid advances in electronic device miniaturization and increasing power density, high thermal conductivity polymer composites with excellent properties are becoming increasingly significant for the progress of next-generation electronic apparatuses. In this work, a new type of three-dimensional (3D) network silicon carbide (SiC) frame and core-shell SiC@SiO2 (SiC@SiO2 ) were successfully prepared. The effects of different filler forms (dispersed particle filler and three-dimensional continuous filler network) on the thermal conductivity of the composites were compared. The composites based on the three-dimensional filler network exhibited evidently better thermal conductivity improvement rates, compared to their traditional counterparts. The thermal conductivity of the epoxy/SiC@SiO2 composite having a total filler content of 17.0 vol% was 0.857 W/m/K, 328.5% higher than that of pure epoxy resin. Similarly, the thermal conductivity of the EP/3D-SiC composite having a total filler content of 13.8 vol% was 1.032 W/m/K, 416.0% higher than that of pure epoxy resin. The abovementioned stats were proven via molecular simulations. We estimated the interfacial thermal resistance (ITR) of the EP/3D-SiC composite to be 5.98 × 10 −8 m 2 K/W, which was an order of magnitude lower than that of the epoxy composites without a 3D network. Simultaneously, computerized molecular simulation technology was used to verify the feasibility of the experiment, which provided new ideas for the preparation of other highly thermally conductive materials. Highlights: A three-dimensional (3D) network silicon carbide frame was successfully prepared by salt template. The effects of different filler forms on the thermal conductivity of composites were compared. The feasibility of the experimental scheme was verified by molecular simulation technology. Combine theory with experiment.