Effect of Indium Additions on the Formation of Interfacial Intermetallic Phases and the Wettability at Sn-Zn-In/Cu Interfaces. (1st October 2017)

• Record Type: Journal Article
• Authors: Pstruś, Janusz; Gancarz, Tomasz; Fima, Przemyslaw
• Other Names: Aizenshtein Michael Academic Editor.
• Is Part Of: Advances in materials science and engineering. Volume 2017(2017)
• Publication Date: 2017-10-01
• Subjects: Materials science -- Periodicals; Materials science; Periodicals; 620.11
• DOI: 10.1155/2017/9756769
• Languages: English
• ISSNs: 1687-8434

Abstract

Abstract : The wettability of copper substrates by Sn-Zn eutectic solder alloy doped with 0, 0.5, 1, and 1.5 at.% of indium was studied using the sessile drop method, with flux, in air, at 250°C and reflow time of 3, 8, 15, 30, and 60 min. Wetting tests were performed at 230, 250, 280, 320, and 370°C for an alloy containing 1.5 at.% of indium, in order to determine activation energy of diffusion. Solidified solder/substrate couples were studied using scanning electron microscopy (SEM), the intermetallic phases from Cu-Zn system which formed at the solder/substrate interface were identified, and their growth kinetics was investigated. The ε -CuZn4 was formed first, as a product of the reaction between liquid solder and the Cu substrate, whereas γ -Cu5 Zn8 was formed as a product of the reaction between ε -CuZn4 and the Cu substrate. With increasing wetting time, the thickness of ε -CuZn4 increases, while the thickness of ε -CuZn4 does not change over time for indium-doped solders and gradually disappears over time for Sn-Zn eutectic solder.