Cite
HARVARD Citation
Merrill, R. et al. (2020). The effects of turmeric on the grain structure and properties of copper electrodeposited composites. Transactions of the Institute of Metal Finishing. pp. 328-335. [Online].
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Merrill, R. et al. (2020). The effects of turmeric on the grain structure and properties of copper electrodeposited composites. Transactions of the Institute of Metal Finishing. pp. 328-335. [Online].