Densely packed 1.1 μm band vertical cavity surface emitting laser array for co-packaged optics. (1st August 2022)

• Record Type: Journal Article
• Authors: Dong, Liang; Gu, Xiaodong; Hu, Shanting; Koyama, Fumio
• Is Part Of: Japanese journal of applied physics. Volume 61:Number SK(2022)
• Publication Date: 2022-08-01
• Subjects: VCSEL -- Co-packaged optics -- multi-core fiber -- VCSEL array; Physics -- Periodicals; 621.05
• DOI: 10.35848/1347-4065/ac64e3
• Languages: English
• ISSNs: 0021-4922

Abstract

Abstract: We demonstrated the 1.1 μ m band 16-channel vertical cavity surface emitting laser (VCSEL) array for multi-core fiber (MCF) transmission towards co-packaged optics. Single-mode 16-ch top and bottom emitting VCSEL arrays were fabricated by either 3 inch or 6 inch wafer foundry process. The thermal crosstalk is estimated by wavelength shift. When the distance between adjacent VCSELs is 40 μ m, the total thermal crosstalk is as low as 7 K. Bottom emitting metal-aperture VCSEL array were also fabricated via a full 3 inch wafer process. It shows low resistance and good single mode characteristic with an oxidation aperture of 7 μ m thanks to an intra-cavity metal aperture. A large mode field diameter of 6 μ m enables low coupling loss between bottom VCSEL array and MCF through a GaAs substrate for a flip-chip bonding process.