Cite
HARVARD Citation
Kwak, J. et al. (2021). Advanced utilization of 3D digital image correlation for thermal and impact reliabilities of electronics components. Microelectronics international. 38 (1), pp. 14-22. [Online].
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Kwak, J. et al. (2021). Advanced utilization of 3D digital image correlation for thermal and impact reliabilities of electronics components. Microelectronics international. 38 (1), pp. 14-22. [Online].