Ag metal interconnect wires formed by pseudoplastic nanoparticles fluid imprinting lithography with microwave assistant sintering. (2nd July 2022)

• Record Type: Journal Article
• Authors: Liu, Boyu; Yu, Yongli; Hu, Zhennan; Li, Mengke; Ma, Liuhong; Sun, Haibin; Jia, Jianxin; Jiang, Changhui; Zhong, Yinghui; Chen, Yuwei; Duan, Zhiyong
• Is Part Of: Nanotechnology. Volume 33:Number 27(2022)
• Publication Date: 2022-07-02
• Subjects: microwave sintering -- nanoimprint -- Ag interconnect -- electron free path -- field assistant sintering; Nanotechnology -- Periodicals; Nanotechnology -- Periodicals; Nanotechnology; Publications périodiques; Nanotechnologies; Periodicals; 620.5
• DOI: 10.1088/1361-6528/ac5eeb
• Languages: English
• ISSNs: 0957-4484

Abstract

Abstract: Nanoimprint technology has the advantages of low cost, high precision, high fidelity and high yield. The metal nanoparticle fluid is non-Newtonian fluid, which is used as the imprint transfer medium to realize high fidelity of pattern because of its shear thinning effect. In order to functionalize the metal nanoparticles microstructure, the subsequent sintering step is required to form a metal interconnect wire. Metal interconnect wire with fewer grain boundaries and fewer holes have excellent mechanical and electronic properties. In this paper, the pseudoplastic metal nanoparticle fluid was formed by Ag nanoparticle and precursor solution, and then the thermal diffusion process was completed by microwave sintering after interconnects were embossed. The influence of microwave and thermal atmosphere on the microstructure and performance of Ag Interconnect wires was analyzed and discussed, and the Ag Interconnect wires performance was determined under the influence of time and temperature parameters. In our experiments, the interconnects after microwave sintering can achieve 39% of the conductivity of bulk silver. The microwave sintering module might be integrated as the heat treatment module of the metal micro/nano pattern directly imprint lithography.