Single-side micromachined ultra-small thermopile IR detecting pixels for dense-array integration. (1st May 2022)

• Record Type: Journal Article
• Authors: Zhou, Wenhan; Zhang, Haozhi; Chen, Pu; Ni, Zao; Li, Wei; Wang, Jiachou; Li, Xinxin
• Is Part Of: Journal of micromechanics and microengineering. Volume 32:Number 5(2022)
• Publication Date: 2022-05-01
• Subjects: thermopile -- infrared detection -- double-level -- single-side micromachined; Microelectromechanical systems -- Periodicals; Micromechanics -- Periodicals; 621.38105
• DOI: 10.1088/1361-6439/ac5c76
• Languages: English
• ISSNs: 0960-1317

Abstract

Abstract: This paper presents a technology to fabricate ultra-small (100 × 100 μ m) thermopile infrared (IR) sensing devices with a novel front-side micromachining process for integration of dense IR detection array. The thermopile IR detection unit is constructed into double-level suspending films, where the IR absorber and n/p-polysilicon thermopile are located at the central-supported upper level and the surrounding-supported lower level, respectively. The separated design for IR absorber and thermopile temperature-detection helps to achieve a high thermocouple fill-factor of 0.9 in terms of the structural area. A single-step wet etching method is proposed to simultaneously release the umbrella-shaped upper-level absorber and the thermal insulation cavity beneath the lower-level thermopile layer. By pre-depositing a polysilicon sacrificial layer, the etching method breakthroughs the restriction of anisotropic over-etch to the single crystalline silicon substrate, thereby maximizing the thermocouple number in the lower-layer film and minimizing the opened area of the etching holes. Finite-element-method simulation results show that the detector with 20 pairs of thermocouples exhibits maximized responsivity than those with more or less pairs of thermocouples. Benefit from the optimized heat dissipation design, the thermopile detection unit in atmospheric environment achieves a high normalized detectivity of 2.1 × 10 7 cm Hz 1/2 W −1, a high responsivity of 52 V W −1 and sound respond time of 1.4 ms. Thanks to the ultra-small unit area, many unites can be densely integrated into IR detection arrays of various scales. As an example, an integrated 4 × 4 IR sensing array is herein fabricated. The 16 integrated pixels demonstrate good consistency in responsivity, with the deviation being less than ±7%. Featuring the tiny-size pixels for dense-array integration and the single-sided micromachining process that is compatible with integrated circuit fabrication, the proposed thermopile IR sensing devices are promising in IR detection applications including consumer-electronic level IR focal plane arrays.