Cite
HARVARD Citation
Gebhart, D. et al. (2022). Linking through-thickness cracks in metallic thin films to in-situ electrical resistance peak broadening. Scripta materialia. p. . [Online].
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Gebhart, D. et al. (2022). Linking through-thickness cracks in metallic thin films to in-situ electrical resistance peak broadening. Scripta materialia. p. . [Online].