Cite
HARVARD Citation
Xiong, M. et al. (2020). Stress analysis and structural optimization of 3-D IC package based on the Taguchi method. Soldering & surface mount technology. 32 (1), pp. 42-47. [Online].
This is an interim version of our Electronic Legal Deposit Catalogue-eJournals and eBooks while we continue to recover from a cyber-attack.
Xiong, M. et al. (2020). Stress analysis and structural optimization of 3-D IC package based on the Taguchi method. Soldering & surface mount technology. 32 (1), pp. 42-47. [Online].