Haptically Quantifying Young's Modulus of Soft Materials Using a Self‐Locked Stretchable Strain Sensor. Issue 25 (22nd August 2021)

• Record Type: Journal Article
• Authors: Cui, Zequn; Wang, Wensong; Guo, Lingling; Liu, Zhihua; Cai, Pingqiang; Cui, Yajing; Wang, Ting; Wang, Changxian; Zhu, Ming; Zhou, Ying; Liu, Wenyan; Zheng, Yuanjin; Deng, Guoying; Xu, Chuanlai; Chen, Xiaodong
• Is Part Of: Advanced materials. Volume 34:Issue 25(2022)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2021-08-22
• Subjects: haptics -- self‐locking -- stretchable strain sensors -- Young's modulus; Materials -- Periodicals; Chemical vapor deposition -- Periodicals; 620.11
• DOI: 10.1002/adma.202104078
• Languages: English
• ISSNs: 0935-9648

Abstract

Abstract: Simple and rapid Young's modulus measurements of soft materials adaptable to various scenarios are of general significance, and they require miniaturized measurement platforms with easy operation. Despite the advances made in portable and wearable approaches, acquiring and analyzing multiple or complicated signals necessitate tethered bulky components and careful preparation. Here, a new methodology based on a self‐locked stretchable strain sensor to haptically quantify Young's modulus of soft materials (kPa–MPa) rapidly is reported. The method demonstrates a fingertip measurement platform, which endows a prosthetic finger with human‐comparable haptic behaviors and skills on elasticity sensing without activity constraints. A universal strategy is offered toward ultraconvenient and high‐efficient Young's modulus measurements with wide adaptability to various fields for unprecedented applications. Abstract : A new methodology (termed LOCK) for simply and rapidly quantifying Young's modulus of soft materials is developed. The LOCK demonstrates a miniaturized and fully mobile fingertip modulus sensor, enabling Young's modulus measurements through a simple touch, independent of touch forces. The method is universal and adaptable to a broad range of fields for opening up new applications.