Cite
HARVARD Citation
Wu, C. et al. (2022). Effects of void and temperature on fracture of Cu/Cu3Sn bilayers: A molecular dynamics study. Materials today communications. p. . [Online].
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Wu, C. et al. (2022). Effects of void and temperature on fracture of Cu/Cu3Sn bilayers: A molecular dynamics study. Materials today communications. p. . [Online].