200 mm sensor development using bonded wafers. (1st February 2021)
- Record Type:
- Journal Article
- Title:
- 200 mm sensor development using bonded wafers. (1st February 2021)
- Main Title:
- 200 mm sensor development using bonded wafers
- Authors:
- Alyari, M.
Bradford, R.
Campanella, M.
Camporeale, P.
Demina, R.
Everts, J.
Gecse, Z.
Halenza, R.
Heintz, U.
Holland, S.
Hong, S.
Korjenevski, S.
Lampis, A.
Lipton, R.
Patti, R.
Segal, J.
Shin, K.W. - Abstract:
- Is Part Of:
- Journal of instrumentation. Volume 16:Number 2(2021)
- Journal:
- Journal of instrumentation
- Issue:
- Volume 16:Number 2(2021)
- Issue Display:
- Volume 16, Issue 2 (2021)
- Year:
- 2021
- Volume:
- 16
- Issue:
- 2
- Issue Sort Value:
- 2021-0016-0002-0000
- Page Start:
- T02002
- Page End:
- T02002
- Publication Date:
- 2021-02-01
- Subjects:
- Scientific apparatus and instruments -- Periodicals
502.84 - Journal URLs:
- http://iopscience.iop.org/1748-0221 ↗
http://ioppublishing.org/ ↗ - DOI:
- 10.1088/1748-0221/16/02/T02002 ↗
- Languages:
- English
- ISSNs:
- 1748-0221
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - BLDSS-3PM
British Library HMNTS - ELD Digital store - Ingest File:
- 21980.xml