Cite
HARVARD Citation
Houzet, G. et al. (2021). In-situ characterization up to 100 GHz of insulators used in new 3D "System in Package on board" (SiPoB) technologies. Microelectronics journal. p. . [Online].
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Houzet, G. et al. (2021). In-situ characterization up to 100 GHz of insulators used in new 3D "System in Package on board" (SiPoB) technologies. Microelectronics journal. p. . [Online].