Electronic microstructure and thermal conductivity modeling of semiconductor nanomaterials. (February 2021)

• Record Type: Journal Article
• Authors: Song, Changqing; Yin, Chuan; Qu, Huiwen
• Is Part Of: Microelectronics journal. Volume 108(2021)
• Publication Date: 2021-02
• Subjects: Semiconductor -- Nanomaterials -- Electronic microstructure -- Thermal conductivity; Microelectronics -- Periodicals; Microélectronique -- Périodiques; Microelectronics; Electronic journals; Journals - contents and abstracts; Periodicals; 621.3805
• DOI: 10.1016/j.mejo.2020.104988
• Languages: English
• ISSNs: 0959-8324

Abstract

Abstract: In order to improve the thermal conductivity of semiconductor materials, the application of nano materials in the thermal conductivity analysis of semiconductor materials is proposed. According to the requirements of electronic microstructure analysis of semiconductor nanomaterials, transmission electron microscope is selected. The innovation of this paper is to establish the thermal conductivity model of semiconductor nanomaterials through the process of unit selection initial analysis specific analysis. Take semiconductor nanomaterials as an example Ti 3 C 2 T x as the experimental object, the structural components and mass of Ti 3 C 2 T x are analyzed by transmission electron microscope. The thermal conductivity of Ti 3 C 2 T x at 80 K–290 K is obtained by T-shape method and thermal conductivity model, which fully confirmed that the experimental object has good structural performance and thermal conductivity.