System-on-chip integrated circuit technology applications on the DIII-D tokamak for multi-field measurements. (1st January 2022)

• Record Type: Journal Article
• Authors: Zheng, Y.; Yu, G.Y.; Chen, J.; Chen, Y.; Zhu, Y.L.; Domier, C.W.; Brower, D.L.; Luhmann, N.C.
• Is Part Of: Journal of instrumentation. Volume 17:Number 1(2022)
• Publication Date: 2022-01-01
• Subjects: Nuclear instruments and methods for hot plasma diagnostics -- Plasma diagnostics — interferometry, spectroscopy and imaging; Scientific apparatus and instruments -- Periodicals; 502.84
• DOI: 10.1088/1748-0221/17/01/C01013
• Languages: English
• ISSNs: 1748-0221

Abstract

Abstract: Several mm-wave diagnostics on the DIII-D tokamak provide multi-scale and multi-dimensional measurements of plasma profile evolution and turbulence fluctuations. Mm-wave fusion plasma diagnostics that adopt system-on-chip integrated circuit technology can provide better space utilization, flexible installation, and improved sensitivity. In order to further extend this technology for additional fusion facilities with a higher toroidal magnetic field, V-band (55–75 GHz) and F-band (90–140 GHz) chips for Microwave Imaging Reflectometer (MIR) and Electron Cyclotron Emission Imaging (ECEI) instruments are developed and tested in the Davis Millimeter Wave Research Center (DMRC). Current measurement data show that correlation between these SoC-based diagnostic instruments with other state-of-the-art diagnostics enables co-located multi-field turbulence fluctuation measurement.