Investigation on thermal conductivity of ceramic particles reinforced polymer composites. (2022)

• Record Type: Journal Article
• Authors: Satheesh kumar, P.; Subramania Pillai, Sivaraja; Subha, V.; Sunil Kumar, M.; Selvaraj, Rajeshkumar; Gaikwad, Priyanka B.; Rajkumar, S.
• Is Part Of: Materials today. Volume 59:Part 2(2022)
• Page Start: 1442
• Page End: 1446
• Publication Date: 2022
• Subjects: Silicon nitride -- Thermal conductivity -- Polyvinyl alcohol; Materials science -- Congresses -- Periodicals; 620.1
• DOI: 10.1016/j.matpr.2021.12.559
• Languages: English
• ISSNs: 2214-7853

Abstract

Abstract: The hydroxyl group count in polymeric composites and amphiphilic investigators used as a function of Si3 N4 orientation have been investigated by the thermal conductivity of Silicon Nitride (Si3 N4 ), PVA and/or PVB. The thermal conductivity of the Si3 N4 compounds in the structure seems to be greater than that of the Si3 N4 outdoor compounds. The thermal conductivity of Si3 N4 /PVA in-plane composites was higher for a specific Si3 N4 component compared to Si3 N4 /PVB in-plane. This could be attributable to Si3 N4 ′s improved orientation because of the presence of a greater number of hydroxyl groups. The amphiphilic C14 H6 O8 treatments have shown higher temperature conductivity than C27 H27 N3 O2 treatments. The evaluated thermal conductance of the composites equated to those predicted by several theoretic models.