Modeling of crack repair using piezoelectric material: XFEM approach. Issue 2 (10th July 2020)

• Record Type: Journal Article
• Authors: Kumar, Ritesh; Pathak, Himanshu; Singh, Akhilendra; Tiwari, Mayank
• Is Part Of: Engineering computations. Volume 38:Issue 2(2021)
• Page Start: 586
• Page End: 617
• Publication Date: 2020-07-10
• Subjects: Piezoelectric -- Stress intensity factor -- J-integral -- Thermo-mechanical loading -- XFEM; Computer-aided engineering -- Periodicals; Computer graphics -- Periodicals; 620.00285
• DOI: 10.1108/EC-01-2020-0001
• Languages: English
• ISSNs: 0264-4401

Abstract

Abstract : Purpose: The purpose of this paper is to analyze the repair of a straight and angular crack in the structure using a piezoelectric material under thermo-mechanical loading by the extended finite element method (XFEM) approach. This provides a general and simple solution for the modeling of crack in the structure to analyze the repair. Design/methodology/approach: The extended finite element method is used to model crack geometry. The crack surface is modeled by Heaviside enrichment function while the crack front is modeled by branch enrichment functions. Findings: The effectiveness of the repair is measured in terms of stress intensity factor and J-integral. The critical voltage at which patch repair is most effective is evaluated and presented. Optimal patch shape, location of patch, adhesive thickness and adhesive modulus are obtained for effective repair under thermo-mechanical loading environment. Originality/value: The presented numerical modeling and simulation by the XFEM approach are of great benefit to analyze crack repair in two-dimensional and three-dimensional structures using piezoelectric patch material under thermo-mechanical loading.