Cite
HARVARD Citation
Tang, Y. et al. (2018). Optimization of the thermal reliability of a four-tier die-stacked SiP structure using finite element analysis and the Taguchi method. Microelectronics journal. pp. 18-23. [Online].
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Tang, Y. et al. (2018). Optimization of the thermal reliability of a four-tier die-stacked SiP structure using finite element analysis and the Taguchi method. Microelectronics journal. pp. 18-23. [Online].