An experimental study on the thermal performance of cellulose-graphene-based thermal interface materials. (April 2019)

• Record Type: Journal Article
• Authors: Jeon, Daechan; Kim, Se Hyun; Choi, Wonjoon; Byon, Chan
• Is Part Of: International journal of heat and mass transfer. Volume 132(2019)
• Page Start: 944
• Page End: 951
• Publication Date: 2019-04
• Subjects: TIM -- Cellulose -- Paper -- Graphene; Heat -- Transmission -- Periodicals; Mass transfer -- Periodicals; Chaleur -- Transmission -- Périodiques; Transfert de masse -- Périodiques; Electronic journals; 621.4022
• DOI: 10.1016/j.ijheatmasstransfer.2018.12.061
• Languages: English
• ISSNs: 0017-9310

Abstract

Highlights: A paper-based TIM is fabricated using graphene and p-polymer. The thermal conductivity is measured using laser flash method. The fabricated graphene paper has significantly enhanced in-plane thermal conductivity. The fabricated graphene paper has good mechanical, thermal and electrical characteristics. Abstract: In this study, an innovative thermal interface material (TIM) paper based on a composite of cellulose and graphene is investigated experimentally. Six types of commercially-available papers: a wool paper; an aqua satin; a merit paper; a new craft board; and two oriental traditional papers (Bulgyeong and Daerye) are used to fabricate the paper-graphene composites via bar coating and a slot die coating. The fabricated TIM papers are lightweight, flexible and robust against tensile strength. The in-plane and through-plane thermal conductivities of the TIM papers are measured using a laser-flash-method (LFM). The measured in-plane thermal conductivities are of the order of 5 W/m-K, whereas the through-plane thermal conductivities are of the order of 0.1 W/m-K. These results suggest that the addition of graphene significantly enhance the in-plane thermal conductivity of papers, while the through-plane thermal conductivities are not significantly improved. The mechanical properties of the TIM papers are also tested. This work provides a new possibility for development of next-generation thermal interface materials with good thermal and mechanical properties.