Modeling of high power light-emitting diode package integrated with micro-thermoelectric cooler under various interfacial and size effects. (1st January 2019)

• Record Type: Journal Article
• Authors: Sun, Dongfang; Liu, Guanyu; Shen, Limei; Chen, Huanxin; Yao, Yu; Jin, Shiping
• Is Part Of: Energy conversion and management. Volume 179(2019)
• Page Start: 81
• Page End: 90
• Publication Date: 2019-01-01
• Subjects: High power light-emitting diode -- Micro-thermoelectric cooler -- Interfacial and size effects -- Performance evaluation; Direct energy conversion -- Periodicals; Energy storage -- Periodicals; Energy transfer -- Periodicals; Énergie -- Conversion directe -- Périodiques; Direct energy conversion; Periodicals; 621.3105
• DOI: 10.1016/j.enconman.2018.10.063
• Languages: English
• ISSNs: 0196-8904

Abstract

Highlights: A model of light emitting- diode with micro- thermoelectric cooler is proposed. Various interfacial and size effects are considered in the presented model. Five structures of micro-coolers are designed to reduce the chip temperature. The impact of interfacial effects on the thermal performance is assessed. The impact of micro-thermoelectric cooler on the optical performance is analyzed. Abstract: Thermoelectric cooler has been widely used in the thermal management of various electronic devices. However, the application of micro- thermoelectric cooler to high power light- emitting diode still needs to be further explored at present. This paper aims to establish a model of high power light- emitting diode package integrated with micro- thermoelectric cooler and explore the performance of this system under various interfacial and size effects. An experiment is conducted to validate the model. Five types of the micro- thermoelectric coolers are designed and integrated to the light- emitting diode package to reduce the localized junction temperature of the light- emitting diode chip. The influence of interfacial effects, thermoelectric element size, and driving power of micro- thermoelectric cooler on the system- level thermal and optical performance is discussed. Results indicate that the micro- thermoelectric cooler with 6 × 6 thermoelectric elements shows the best cooling performance for the driving power of micro- thermoelectric cooler lower than 0.85 W. For thermoelectric cooler with 6 × 6 thermoelectric elements, a minimum chip junction of 95.9 °C, which is 12.3 °C lower than that of the light- emitting diode without micro- thermoelectric cooler, can be achieved. This characteristic can increase the luminous efficacy and lifetime by 12.3% and 50%, respectively. It also found that the electrical boundary resistance plays a more dominant role, compared with the thermal boundary resistance. However, the thermal contact resistance exhibits greater adverse impact than the electrical contact resistance. In addition, a total performance improvement proportion of 25.5% can still be achieved, although the micro- thermoelectric cooler consumes power energy by 22.5% at the driving power of 0.87 W.