The Effect of a Small Copper Addition on the Electrical Conductivity of Aluminum. Issue 6 (13th March 2020)

• Record Type: Journal Article
• Authors: Lapovok, Rimma; Berner, Alex; Qi, Yuanshen; Xu, Chunjee; Rabkin, Eugen; Beygelzimer, Yan
• Is Part Of: Advanced engineering materials. Volume 22:Issue 6(2020)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2020-03-13
• Subjects: conductivities -- copper–aluminum hybrid materials -- interfaces -- intermetallics -- powder compaction -- reciprocal extrusions; Materials -- Periodicals; 620.11
• DOI: 10.1002/adem.202000058
• Languages: English
• ISSNs: 1438-1656

Abstract

Abstract : Aluminum powder blended with 10, 20, and 30 wt% of copper powder is compacted at 400 °C by four reciprocal extrusion passes. Simultaneous compaction and strengthening result in more than double increase in mechanical strength characteristics for 20 and 30 wt% of copper and a significant increase in electrical conductivity for 30 wt% of copper. This phenomenon is investigated here by the expansion of the "effective media" model for a random binary mixture so that it includes the presence of intermetallic phases and considers the distribution of large copper agglomerates. Abstract : Aluminum powder blended with 10–30 wt% of copper powder is compacted at 400 °C by reciprocal extrusion. Simultaneous compaction and strengthening result in significant increase in mechanical strength for 20 and 30 wt% of copper and in electrical conductivity for 30 wt% of copper. This phenomenon is investigated by the expansion of the "effective media" model.