Solvent-free amide bond formation using a variety of methoxysilanes as coupling agent. Issue 18 (20th April 2022)

• Record Type: Journal Article
• Authors: Lainer, Thomas; Czerny, Frank; Haas, Michael
• Is Part Of: Organic & biomolecular chemistry. Volume 20:Issue 18(2022)
• Page Start: 3717
• Page End: 3720
• Publication Date: 2022-04-20
• Subjects: Chemistry, Organic -- Periodicals; Bioorganic chemistry -- Periodicals; Chemistry, Physical organic -- Periodicals; 547
• DOI: 10.1039/d2ob00589a
• Languages: English
• ISSNs: 1477-0520

Abstract

Abstract : A new solvent-free procedure for the formation of amide bonds without exclusion of air and moisture is described. As coupling agent tetramethoxysilane 1, hexamethoxydisilane 2 and dodecamethoxyneopentasilane 3 were used. Abstract : A solvent-free procedure for the formation of amides without exclusion of air and moisture is described. Using tetramethoxysilane 1, hexamethoxydisilane 2 and dodecamethoxy-neopentasilane 3 as coupling agent carboxylic acids and amines are reacted to form amides in good to excellent yields. The formation of these amides was confirmed by NMR spectroscopy and mass spectrometry. Remarkably, neopentasilane 3 exceeds the performance of the currently used monosilanes as coupling agent in terms of group tolerance and yield.