Ultra-high thermal conductive epoxy-based copper/graphite nanoplatelets materials for heat management application. (16th June 2022)
- Record Type:
- Journal Article
- Title:
- Ultra-high thermal conductive epoxy-based copper/graphite nanoplatelets materials for heat management application. (16th June 2022)
- Main Title:
- Ultra-high thermal conductive epoxy-based copper/graphite nanoplatelets materials for heat management application
- Authors:
- Wang, Xiaotong
Pu, Zhichen
Yang, Yiming
Wei, Baojie
Yang, Shuangqiao - Abstract:
- Abstract: The combination of polymer and copper (Cu) is common and economical in thermal interface materials (TIMs). However, it is remains challenging for traditional polymer-Cu composites to obtain high thermal conductivity (TC) (>10 Wm −1 K −1 ) due to the poor filler connection. Herein, we introduced small amount of 2D-structured graphite nanoplatelets (GNPs) into bulk Cu flakes/epoxy composites via the thermal molding method. Surprisingly, we found an extraordinary synergistic effect, revealed highly thermally conductive percolation network through intercalation of GNPs between Cu flakes. A high isotropic TC 13.4 Wm −1 K −1 is achieved with 5 wt% GNPs and 80 wt% Cu flakes, which superior than most reported Cu/polymer composites. Although a high electrical conductivity of 34000 S/m was obtained, a phonon-dominated thermal transport mechanism was observed due to the existence of GNPs bridges between Cu flakes. The resulting composite also demonstrate excellent thermal management ability, superior acid resistance and good mechanical property, which offers a promising composite in thermal management application. Graphical abstract: Image 1 Highlights: An epoxy/Cu/graphite-nanoplates composite (GNPs) was fabricated via a simple hot-pressing method. The GNPs bridged between Cu flakes and realized pronounced thermal conductivity at 13.4 Wm −1 K −1 . The composite possessed outstanding thermal management and self-warming ability. The composite showed satisfied comprehensiveAbstract: The combination of polymer and copper (Cu) is common and economical in thermal interface materials (TIMs). However, it is remains challenging for traditional polymer-Cu composites to obtain high thermal conductivity (TC) (>10 Wm −1 K −1 ) due to the poor filler connection. Herein, we introduced small amount of 2D-structured graphite nanoplatelets (GNPs) into bulk Cu flakes/epoxy composites via the thermal molding method. Surprisingly, we found an extraordinary synergistic effect, revealed highly thermally conductive percolation network through intercalation of GNPs between Cu flakes. A high isotropic TC 13.4 Wm −1 K −1 is achieved with 5 wt% GNPs and 80 wt% Cu flakes, which superior than most reported Cu/polymer composites. Although a high electrical conductivity of 34000 S/m was obtained, a phonon-dominated thermal transport mechanism was observed due to the existence of GNPs bridges between Cu flakes. The resulting composite also demonstrate excellent thermal management ability, superior acid resistance and good mechanical property, which offers a promising composite in thermal management application. Graphical abstract: Image 1 Highlights: An epoxy/Cu/graphite-nanoplates composite (GNPs) was fabricated via a simple hot-pressing method. The GNPs bridged between Cu flakes and realized pronounced thermal conductivity at 13.4 Wm −1 K −1 . The composite possessed outstanding thermal management and self-warming ability. The composite showed satisfied comprehensive properties. … (more)
- Is Part Of:
- Composites science and technology. Volume 224(2022)
- Journal:
- Composites science and technology
- Issue:
- Volume 224(2022)
- Issue Display:
- Volume 224, Issue 2022 (2022)
- Year:
- 2022
- Volume:
- 224
- Issue:
- 2022
- Issue Sort Value:
- 2022-0224-2022-0000
- Page Start:
- Page End:
- Publication Date:
- 2022-06-16
- Subjects:
- Copper flakes -- Graphite nanoplatelets -- Synergistic effect -- Thermal conductivity -- Self-warming
Composite materials -- Periodicals
Composite materials
Fibrous composites
Periodicals
620.118 - Journal URLs:
- http://www.sciencedirect.com/science/journal/02663538 ↗
http://www.elsevier.com/journals ↗ - DOI:
- 10.1016/j.compscitech.2022.109454 ↗
- Languages:
- English
- ISSNs:
- 0266-3538
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - 3365.650000
British Library DSC - BLDSS-3PM
British Library HMNTS - ELD Digital store - Ingest File:
- 21571.xml