Excellent thermoelectric properties and stability realized in copper sulfides based composites via complex nanostructuring. (July 2022)

• Record Type: Journal Article
• Authors: Zhang, Yi-Xin; Lou, Qing; Ge, Zhen-Hua; Gu, Shi-Wei; Yang, Jun-Xuan; Guo, Jun; Zhu, Yu-Ke; Zhou, Ying; Yu, Xiao-Hua; Feng, Jing; He, Jiaqing
• Is Part Of: Acta materialia. Volume 233(2022)
• Publication Date: 2022-07
• Subjects: Complex nanostructuring -- Copper sulfide -- Thermoelectric properties -- Synergetic optimization -- Nanoprecipitates; Materials -- Periodicals; Materials science -- Periodicals; Materials -- Mechanical properties -- Periodicals; Metallurgy -- Periodicals; Chemistry, Inorganic -- Periodicals; 620.112
• DOI: 10.1016/j.actamat.2022.117972
• Languages: English
• ISSNs: 1359-6454

Abstract

Abstract: Nanostructuring is a conventional approach to decrease thermal conductivity, nevertheless, the effect of grain boundaries on scattering phonon is limited. Herein, a new approach of constructing complex nanostructures is proposed. The copper sulfides-based nanocomposites with high thermoelectric properties and phase stability were fabricated by combining with solid-state reaction and spark plasma sintering techniques. The main phase of Cu12 Sb4 S13 and Cu1.96 S with complex nanostructures is obtained by introducing CoSb3 additive to Cu1.8 S matrix. Hole concentration in p-type composites is tailored by regulating Cu vacancies concentration and Co 3+ doping in Cu + sites, resulting in the significantly enhanced Seebeck coefficient and carrier thermal conductivity reduction. Furthermore, an ultralow thermal conductivity of 0.47 W m −1 K −1 at 773 K is achieved due to the tuned carrier concentration and the enhanced phonons scattering by continuous nanopores, extra phase interfaces and nanoprecipitates. The record high ZT of 1.6 is achieved at 773 K in Cu-S based thermoelectric material system for the composite specimen, namely Cu1.8 S-5 wt.% CoSb3 . Our result provides a new strategy to construct complex nanostructures and realize spontaneous composition regulation in improving TE performance of copper sulfide-based materials. Graphical abstract: Image, graphical abstract