Topology for Substrate Routing in Semiconductor Package Design. (August 2022)

• Record Type: Journal Article
• Authors: Seong, Rak-Kyeong; Yang, Jaeho; Han, Sang-Hoon
• Is Part Of: Computer aided design. Volume 149(2022)
• Publication Date: 2022-08
• Subjects: Substrate routing -- Geometric topology -- Semiconductor package design; Computer-aided design -- Periodicals; Engineering design -- Data processing -- Periodicals; Computer graphics -- Periodicals; Conception technique -- Informatique -- Périodiques; Infographie -- Périodiques; Computer graphics; Engineering design -- Data processing; Periodicals; Electronic journals; 620.00420285
• DOI: 10.1016/j.cad.2022.103269
• Languages: English
• ISSNs: 0010-4485

Abstract

Abstract: In this work, we propose a new signal routing method for solving routing problems that occur in the design process of semiconductor package substrates. Our work uses a topological transformation of the layers of the package substrate in order to simplify the routing problem into a problem of connecting points on a circle with non-intersecting straight line segments. The circle, which we call the Circular Frame, is a polygonal schema, which is originally used in topology to study the topological structure of 2-manifolds. We show through experiments that our new routing method based on the Circular Frame competes with certain grid-based routing algorithms. Highlights: The proposed geometric transformation simplifies substrate routing problems in semiconductor package design. The proposed geometric transformation maps a substrate layer to a topologically equivalent representation of the original environment. The new environment guarantees full connection during the routing process without the need of rip-out and reroute mechanisms. The proposed topological router is faster and more reliable than standard grid-based routers used for substrate design.