Cite
HARVARD Citation
Yang, B. et al. (2022). A thermal latent imidazole complex containing copper (II) as the curing agent for an epoxy-based glass fiber composite. Textile research journal. 92 (11), pp. 1867-1875. [Online].
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Yang, B. et al. (2022). A thermal latent imidazole complex containing copper (II) as the curing agent for an epoxy-based glass fiber composite. Textile research journal. 92 (11), pp. 1867-1875. [Online].