Pool Boiling Heat Transfer on a Micro‐Structured Copper Oxide Surface with Varying Wettability. Issue 5 (10th March 2022)

• Record Type: Journal Article
• Authors: Sen, Pulak; Kalita, Sanjib; Sen, Dipak; Das, Sudev; Das, Ajoy Kumar
• Is Part Of: Chemical engineering & technology. Volume 45:Issue 5(2022)
• Page Start: 808
• Page End: 816
• Publication Date: 2022-03-10
• Subjects: Boiling heat transfer coefficient -- Bubble dynamics -- Chemical etching -- Critical heat flux -- Microstructured copper oxide surface; Chemical engineering -- Periodicals; Chemical processes -- Periodicals; 660.05
• DOI: 10.1002/ceat.202100558
• Languages: English
• ISSNs: 0930-7516

Abstract

Abstract: Copper surface is modified to copper oxide surface for high heat flux electronics applications. Copper oxide surface is prepared by chemical etching using NaOH and (NH4 )2 S2 O8 . A pool boiling experiment is conducted to investigate the critical heat flux (CHF) and boiling heat transfer coefficient (BHTC). The results indicate that BHTC of all copper oxide surfaces are enhanced remarkably. Bubble dynamics are also analyzed by means of a high‐speed camera. Bubble visualization demonstrates that the active nucleation sites for the copper oxide surfaces are higher than the bare copper surface. Abstract : Experiments are conducted to study bubble dynamics and pool boiling heat transfer. The hydrophilic surface shows the highest critical heat flux, whereas the hydrophobic surface exhibits a greater boiling heat transfer coefficient. High‐speed visualization of water pool boiling is performed. The dynamics of vapor bubble growth and separation are studied in a wide range of heat fluxes.