Cite
HARVARD Citation
Geng, T. et al. (2022). Electrodeposition of Cu onto Au(111) from Deep Eutectic Solvents: Molar Ratio of Salt and Hydrogen Bond Donor. ChemElectroChem. 9 (7), p. n/a. [Online].
This is an interim version of our Electronic Legal Deposit Catalogue-eJournals and eBooks while we continue to recover from a cyber-attack.
Geng, T. et al. (2022). Electrodeposition of Cu onto Au(111) from Deep Eutectic Solvents: Molar Ratio of Salt and Hydrogen Bond Donor. ChemElectroChem. 9 (7), p. n/a. [Online].