A review on in‐mold electronics technology. Issue 4 (11th February 2022)

• Record Type: Journal Article
• Authors: Beltrão, Mariana; Duarte, Fernando M.; Viana, Júlio C.; Paulo, Vitor
• Is Part Of: Polymer engineering & science. Volume 62:Issue 4(2022)
• Page Start: 967
• Page End: 990
• Publication Date: 2022-02-11
• Subjects: injection molding -- processing -- thin films; Polymer engineering -- Periodicals; Polymers -- Periodicals; 668.9
• DOI: 10.1002/pen.25918
• Languages: English
• ISSNs: 0032-3888

Abstract

Abstract: In Mold Decoration (IMD) with printed electronic films combines the printed functional film with the IMD process, creating a product with embedded electronic functions that requires much less space compared to previous technologies. In Mold Electronics (IME) is a process of integrating printed decorations and functional electronics with IMD (i.e., thermoforming and injection molding), resulting in 3D‐shaped objects with embedded electronic functions. This technique is a field of recent large technological and scientific interests due to its wide application, aesthetically appealing, and durable and lighter functional products. This paper reviews the state‐of‐the‐art of IME technology, resorting to scientific research work performed and its main outputs, compiling and analyzing the main knowledge and achievements on the process up to date. First, an overview of the IME process steps is given, as well as, its components, main applications, advantages, and drawbacks. The main IME printing technologies are listed, and the relevant material parameters of the foil and of the conductive inks for the printing process are also discussed. The effects of the thermoforming and injection molding steps on the foil behavior and final product are also addressed. Main challenges still to overcome on the IME technology are presented. Abstract : In‐mold electronics (IME) is a process of integrating printed decorations and functional electronics with IMD, creating a product with embedded electronic functions. In this paper is reviewed the state‐of‐the‐art of IME technology. An overview of the IME process steps, main applications, advantages and drawbacks is given. Main challenges still to overcome on the IME technology are presented.