Cite
HARVARD Citation
Yan, H. et al. (2022). Aging behaviour of encapsulated assemblies of epoxy resin under accelerated thermal cycling. International journal of polymer analysis and characterization. 27 (3), pp. 180-194. [Online].
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Yan, H. et al. (2022). Aging behaviour of encapsulated assemblies of epoxy resin under accelerated thermal cycling. International journal of polymer analysis and characterization. 27 (3), pp. 180-194. [Online].