Enhanced dielectric constant and suppressed electrical conductivity in polymer nanocomposite films via loading MXene/TiO2/MoS2 nanosheets. Issue 8 (15th April 2022)

• Record Type: Journal Article
• Authors: Ma, Wenjiao; Yang, Ke; Zhou, Conghua; Li, Hengfeng
• Is Part Of: Ceramics international. Volume 48:Issue 8(2022)
• Page Start: 10447
• Page End: 10457
• Publication Date: 2022-04-15
• Subjects: MXene/TiO2/MoS2 nanosheets -- Semiconductive layers -- Nanocomposite films -- Dielectric properties -- Finite element simulation; Ceramics -- Periodicals; Céramique industrielle -- Périodiques; Ceramics; Periodicals; Electronic journals; 666
• DOI: 10.1016/j.ceramint.2021.12.253
• Languages: English
• ISSNs: 0272-8842

Abstract

Abstract: Conductor/polymer nanocomposites can achieve high dielectric constant with low filler loading, but conductive fillers come into contact with each other easily, resulting in the formation of conductive paths. In this work, MXene/TiO2 /MoS2 nanosheets were prepared by one-step hydrothermal method, and MXene/TiO2 /MoS2 /poly(vinylidene fluoride-co-hexafluoropropylene) (P(VDF-HFP)) nanocomposite films were prepared by solution casting method. At 1 kHz, with an optimized MXene/TiO2 /MoS2 nanosheets loading of 8.0 wt%, MXene/TiO2 /MoS2 /P(VDF-HFP) nanocomposite films achieve a high dielectric constant of 944 and maintain a low dielectric loss of 0.19. TiO2 and MoS2 semiconductive layers on the surface of MXene nanosheets can prevent the formation of conductive paths, and therefore, nanocomposite films possess suppressed electrical conductivity. Moreover, MXene/TiO2 /MoS2 nanosheets can build more microcapacitor structures in nanocomposite films with higher filler loading, which further improves the dielectric constant of nanocomposite films. Finite element simulation shows that TiO2 and MoS2 semiconductive layers can lower the electric field intensity and polarization intensity at the interface between conductive fillers and polymer matrix. Herein, MXene/TiO2 /MoS2 /P(VDF-HFP) nanocomposite films possess not only excellent dielectric properties, but also excellent mechanical properties, which can be used as flexible dielectric materials in electronic packaging technology.