Low‐dielectric constant and viscosity tetrafunctional bio‐based epoxy resin containing cyclic siloxane blocks. Issue 20 (1st February 2022)

• Record Type: Journal Article
• Authors: Zhang, Pengbo; Yao, Tongjie; Xue, Kangle; Meng, Xianbin; Zhang, Junying; Liu, Li
• Is Part Of: Journal of applied polymer science. Volume 139:Issue 20(2022)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2022-02-01
• Subjects: biomaterials -- dielectric properties -- resins -- viscoelasticity -- viscosity; Polymers -- Periodicals; Polymerization -- Periodicals; 668.9
• DOI: 10.1002/app.52176
• Languages: English
• ISSNs: 0021-8995

Abstract

Abstract: Bio‐based epoxy resins with low‐dielectric constant, low viscosity and excellent mechanical properties have great significance for the future of advanced electronic and microelectronic industries. Cyclosiloxane segment possesses low polarity, high‐dissociation energy, and elevated molecular volume, thereby making it useful for the synthesis of materials with low dielectric constant and viscosity. Herein, a tetrafunctional eugenol‐based epoxy resin (DEP) based on a cyclosiloxane structure was designed and prepared through a hydrosilylation reaction. Allyl glycidyl ether (AGE) was selected as a reference compound and generated a silylation epoxy resin (AGDEP). The viscosity of these silicone‐containing tetrafunctional epoxy monomers (< 0.315 Pa·s) was significantly lower than that of the conventional oil‐based epoxy resin (14.320 Pa·s). After curing with methyl hexahydrophthalic anhydride (MHHPA), the dielectric constant of DEP‐MHHPA was as low as 2.8 (10 MHz), which was superior to that of EP‐MHHPA. Notably, the glass transition temperature ( T g ) of DEP‐MHHPA was as high as 100.3°C. The tensile strength and elongation at break of DEP‐MHHPA were estimated to be 66.1 MPa and 6.0%, respectively. Multifunctional eugenol‐based epoxy monomers with low‐dielectric constant and viscosity provide an efficient guideline for building epoxy‐based materials to better design future‐oriented engineering materials. Abstract :