Non-covalently modified graphene@poly(ionic liquid) nanocomposite with high-temperature resistance and enhanced dielectric properties. (March 2022)

• Record Type: Journal Article
• Authors: Yuan, You; Wang, Xinhua; Liu, Xiaoyun; Qian, Jun; Zuo, Peiyuan; Zhuang, Qixin
• Is Part Of: Composites. Volume 154(2022)
• Publication Date: 2022-03
• Subjects: A. Hybrid -- A. Polymer-matrix composites (PMCs) -- B. Electrical properties -- B. High-temperature properties; Composite materials -- Periodicals; Manufacturing processes -- Periodicals; Composite materials; Manufacturing processes; Periodicals; 620.11805
• DOI: 10.1016/j.compositesa.2021.106800
• Languages: English
• ISSNs: 1359-835X

Abstract

Graphical abstract: Highlights: Non-covalent modification preserves the structure of graphene and improves dispersibility. π-π conjugation avoids filler stacking and contributes to the formation of microcapacitors. Double polymer shell extends breakdown path and increases interfacial polarization. Excellent thermal stability, heat transfer and strong interfacial structure eliminate thermal failure. Abstract: Dielectric polymer composites as energy storage components greatly promote the development of high-performance power electronic devices. However, the failure under high voltage and high temperature is still the main problem to be solved. In this work, a non-covalently modified graphene@poly(ionic liquid) (RGO@PIL) nanohybrid has been elaborately designed. The π-π conjugated structure of the nanohybrid prevents the filler from overlapping and improves its dispersion, thus improving the breakdown strength by effectively extending the breakdown path. The double polymer shell structure formed after the introduction of poly(ionic liquid) not only enhances the interfacial polarization effect but also significantly transfers heat evenly within the nanocomposites avoiding failure at high temperatures. At the frequency of 1 kHz and at 200 °C, the permittivity of the nanocomposite film reaches 35.51, with a high breakdown strength of 122.96 kV/mm. This work demonstrates a promising strategy to manufacture the electronic circuit equipment materials for applications under extreme environments.