Reflow Soldering-Resistant Solid-State 3D Micro-Supercapacitors Based on Ionogel Electrolyte for Powering the Internet of Things. Issue 10 (24th June 2020)

• Record Type: Journal Article
• Authors: Asbani, B.; Bounor, B.; Robert, K.; Douard, C.; Athouël, L.; Lethien, C.; Le Bideau, J.; Brousse, T.
• Is Part Of: Journal of the Electrochemical Society. Volume 167:Issue 10(2020)
• Publication Date: 2020-06-24
• Subjects: Electrochemistry -- Periodicals; 541.3705
• DOI: 10.1149/1945-7111/ab9ccc
• Languages: English
• ISSNs: 0013-4651

Abstract

Abstract : The fabrication of all solid-state 3D micro-supercapacitor is challenging for powering connected and miniaturized emerging electronics devices in the frame of the future Internet of Things paradigm. Here we highlight the design of a specific solid electrolyte based on ethylmethylimidazolium bis(trifluoromethanesulfonate)imide confined within polyvinylidenefluoride which enables to meet the requirements of safety, easy packaging, and leakage free 3D micro-supercapacitors. This ionogel-based microdevice (2 mm × 2 mm footprint area) exhibits good cycling stability over 30 000 cycles with an areal energy density of 4.4 μ Wh.cm −2 and a power density of 3.8 mW.cm −2 . It can also sustain the high temperature reflow soldering process (∼250 °C–5 min) without damage, which is performed to directly bond surface mounted miniaturized devices onto printed circuit boards. This strategy not only provides a reference for the design of high-performance 3D interdigitated micro-supercapacitors, but also paves the way to their further implementation in miniaturized electronic chips for Internet of Things applications.