Characterization of novel high-speed die attachment method at 225 °C using submicrometer Ag-coated Cu particles. (June 2018)

• Record Type: Journal Article
• Authors: Lee, Chang Hyun; Choi, Eun Byeol; Lee, Jong-Hyun
• Is Part Of: Scripta materialia. Number 150(2018)
• Page Start: 7
• Page End: 12
• Publication Date: 2018-06
• Subjects: Sintering -- Surface modification -- Nanostructured materials -- Electronic packaging -- Bonding by silver dewetting; Materials -- Periodicals; Metallurgy -- Periodicals; Metalen; Legeringen; Materiaalkunde; Metals, metalworking and machinery industries; Metals; Electronic journals; 620.11
• DOI: 10.1016/j.scriptamat.2018.02.029
• Languages: English
• ISSNs: 1359-6462

Abstract

Abstract: A novel die-attaching technology, using the in-situ dewetting of Ag shells in submicrometer Ag-coated Cu (Cu@Ag) particles during heating in air, was suggested for power device packaging. The particle size-dependent dewetting of Ag induced the formation of tiny nodules and rapid sinter bonding via fast Ag transfer under external pressure. A die attached by thermal compression for 5 min at 225 °C using 200- or 350-nm Cu@Ag particles showed shear strengths approaching or surpassing that (18.0 MPa) of a die attached using Pb-5Sb. Graphical abstract: Unlabelled Image